Various Pin configurations with Certificated IP50 to IP69/Hermatic Sealing for dust and water. Best suited for Defense, Security, Medical and Industrial
High-Performance Precision RF connectors, components and RF cable assemblies, Micro High Frequency U.FL and W.FL, High-Performance Test Systems available
Integral ground planes, high-density arrays, ExaMAX backplane interconnects, rugged Edge Rate systems and high-speed performance to 28+ Gbps
Interconnect systems with fine pitch availability as small as 0.40 mm and stack heights as low as 1 mm.
Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.
Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.
High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.
ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays
