DDR3 ECC SODIMM ULP
- Small Outline Dual In-line Memory Module
- Ultra-Low Profile Feature Specialized For Use in 1U System
- Single Error Correction and Detection Available
- Fully Tested and Optimized for Stability and Performance
- Uses Original IC to Meet Strict Industrial Standards
- JEDEC Standard 1.5V (1.425V~1.575V) & 1.35V (1.28V~1.45V)
- Operating Environment : 0°C ~ 85°C
- 30μ” Gold Finger
- RoHS Compliance
- CE/FCC Certification
Overview:
DDR3 ECC SODIMM ULP is an ultra low-profile, compact industrial memory module that provides lasting performance, and is designed for the server, telecom and networking markets. The modules come equipped with 30μ” Gold Fingers and include single bit error correction. 2GB and 4GB capacities are available, as well as data transfer rates of 1333MT/s and 1600MT/s.
ULP modules are specialized for use in 1U systems, such as blade server data centers, where system height is lower than 1.18 inches. The design of these modules improves airflow inside the system and reduces thermal impact.
ECC modules are designed to detect and correct single-bit errors that occur during data storage and transmission. ECC modules use Hamming Code or Triple Modular Redundancy for error detection and correction, and manage error corrections on their own, without requesting that the data source resend original data.
DDR3 ECC SODIMM ULP is an ultra low-profile, compact industrial memory module that provides lasting performance, and is designed for the server, telecom and networking markets. The modules come equipped with 30μ” Gold Fingers and include single bit error correction. 2GB and 4GB capacities are available, as well as data transfer rates of 1333MT/s and 1600MT/s.
ULP modules are specialized for use in 1U systems, such as blade server data centers, where system height is lower than 1.18 inches. The design of these modules improves airflow inside the system and reduces thermal impact.
ECC modules are designed to detect and correct single-bit errors that occur during data storage and transmission. ECC modules use Hamming Code or Triple Modular Redundancy for error detection and correction, and manage error corrections on their own, without requesting that the data source resend original data.
Specifications:
Interface DDR3 Form Factor ECC SODIMM ULP Data Rate 1333 MT/s, 1600 MT/s Capacity 2GB, 4GB Function ECC Unbuffered Memory Pin Number 204pin Width 72Bits Voltage 1.5V, 1.35V PCB Height 0.709 Inches Operating Temperature 0°C to 85°C 30μ” Gold Finger Y
Interface | DDR3 |
Form Factor | ECC SODIMM ULP |
Data Rate | 1333 MT/s, 1600 MT/s |
Capacity | 2GB, 4GB |
Function | ECC Unbuffered Memory |
Pin Number | 204pin |
Width | 72Bits |
Voltage | 1.5V, 1.35V |
PCB Height | 0.709 Inches |
Operating Temperature | 0°C to 85°C |
30μ” Gold Finger | Y |
Order Information:
Density Component
Composition Part Number Rank Voltage Description 2GB 256Mx8 M3D0-2GSJYLPC 1Rx8 1.5V/1.35V DDR3 1600 ECC SODIMM ULP 4GB 512Mx8 M3D0-4GSSYLPC 1Rx8 1.5V/1.35V DDR3 1600 ECC SODIMM ULP
Density | Component Composition | Part Number | Rank | Voltage | Description |
2GB | 256Mx8 | M3D0-2GSJYLPC | 1Rx8 | 1.5V/1.35V | DDR3 1600 ECC SODIMM ULP |
4GB | 512Mx8 | M3D0-4GSSYLPC | 1Rx8 | 1.5V/1.35V | DDR3 1600 ECC SODIMM ULP |