Tek Parça / Kompresyon

• Current Rating: 2.4 A per pin
• Contacts: Up to 30 I/Os
• Screw insert option for rugged environments
• Alignment pins on either side of connector
• Large contact deflection
• Optional alignment pins

• For high-shock, vibration, rugged applications
• Elevated and low profiles from 3 mm to 10 mm
• Optional screw mounts and alignment pins
• Single and double row designs

• 1.27 mm and 2 mm standard body heights
• 1.00 mm pitch
• Dual compression or single compression with solder balls
• 100 – 400 total pins
• Ideal for low cost board stacking, module-to-board and LGA interfaces
• Minimizes thermal expansion issues

As a high-speed, high-density connector, Z-Ray^® provides the ultimate in design flexibility, from custom heights to full custom geometries. As an interposer, Z-Ray^® is a cost-saving removable interface between the IC package and main board. Z-Ray^® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, as dual compression or single compression with solder balls. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

• Low-profile 1 mm body height (ZA8, ZA1 Series)
• 0.33 mm height for shortest signal path (ZA8H Series)
• One piece design

• Customer-specific pin counts for ultimate high density and speed flexibility
• Choice of 0.80 mm or 1.00 mm pitch grid
• Up to 400 I/Os standard with custom capabilities to 3,000+ I/Os
• Also Available: 1.00 mm pitch system with up to 400 I/Os,1.27 mm and 2 mm standard heights, and up to 56 Gbps performance (GMI Series)

• Configurations for any application, complete with detailed footprints
• Dual compression or single compression with solder balls
• Customer-specific stack heights, pin counts, insulator shapes, and plating thicknesses
• Customizable in the X, Y, and Z axes
• Wide variety of custom geometries
• Quick-turn customization with minimal NRE and tooling charges
• A variety of compression and alignment configurations available

• Performance up to 14 Gbps (ZA8, ZA1 Series) and 56 Gbps NRZ (ZA8H Series) with a migration path to 100 Gbps
• Up to 1,000 cycles, with alternate contact design for up to 3,000 cycles also available (tested to 85˚C)
• Low 30 g normal force with .008" contact deflection
• 500 mA per line
• Differential Vias™ PCB routing available
• Also Available: 1.00 mm pitch system with up to 400 I/Os, 1.27 mm and 2 mm standard heights, and up to 56 Gbps performance
  (GMI Series)
• Also Available: Ultra-low profile Z-Ray® Cable Assembly designed for high-speed, micro pitch applications (ZRDP Series)

• Engineered to provide precise alignment, compression and retention of dual compression (LGA) or single compression with solder balls (BGA) Z-Ray^®Interposers
• Z-Ray^® hardware systems are ultra-low profile and designed to reduce risk of damage to the interposer
• ZSO Series provides alignment for single compression solder ball interposers
• ZHSI Series provides alignment and ensures proper contact retention for dual compression interposers
• ZD Series press-in hardware provides proper PCB to interposer alignment for dual compression interposers