Ultra Mikro

• Ultra fine pitch – 0.40 mm and 0.50 mm
• Ultra low stack down to 2.00 mm
• Slim body design for increased board space savings

AcceleRate® HD ultra-dense, multi-row mezzanine strips are rated for 56 Gbps PAM4 on a 0.635 mm pitch. 

AcceleRate® HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications.

The surface of the contact is milled creating a smooth mating surface, which reduces wear on the contact increasing durability and cycle life. Also, lower insertion and withdrawal forces allow zippered unmating.

• Incredibly dense with up to 240 total I/Os
• Low profile 5 mm stack height
• Slim 5 mm width
• 4-row design; 10 - 60 positions per row (40 - 240 total positions)
• Edge Rate® contact system optimized for signal integrity performance
• Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
• Solder ball technology for simplified processing and self aligning
• Additional stack heights and higher pin counts in development

• 0.80 mm (.0315") pitch grid
• 50% board space savings versus .050" (1.27 mm) pitch SEARAY™
• Performance: Up to 17.5 GHz / 35 Gbps
• Rugged Edge Rate® contact system
• Up to 500 I/Os
• 7 mm and 10 mm stack heights
• Solder charge terminations for ease of processing
• Samtec 28+ Gbps Solution
• Final Inch® certified for Break Out Region trace routing recommendations (patent pending)

These low profile, high-speed arrays feature a dual beam contact system on a 1.27 mm x 1.27 mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. This system is available in 4 mm, 4.5 mm and 5 mm mated heights with up to 320 total pins in 4, 6 or 8 row configurations.

They support 28+ Gbps applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

• 4 mm, 4.5 mm, 5 mm stack heights
• Up to 320 I/Os
• 4, 6 and 8 row designs
• .050" (1.27 mm) pitch
• Dual beam contact system
• Solder crimp termination for ease of processing
• Performance up to 18.5 GHz / 37 Gbps

Samtec’s Edge Rate® contact system is designed for high speed, high cycle applications. The surface of the Edge Rate® contact is milled creating a smooth mating surface area instead of a stamped contact that mates on a cut edge. This smooth mating surface reduces the wear tracks on the contact increasing the durability and cycle life of the contact system. It also lowers insertion and withdrawal forces allowing the connectors to be zippered when unmating. 

• Edge Rate® contacts optimized for signal integrity performance
• 1.5 mm contact wipe
• Robust when "zippered" during unmating
• Up to 56 Gbps PAM4 performance
• 0.50 mm, 0.635 mm or 0.80 mm pitch systems
• Stack heights from 5 mm to 18 mm
• Extremely slim 2.5 mm body width on 0.635 mm pitch system
• 0.50 mm pitch system for up to 40% PCB space savings vs 0.80 mm pitch system

As a high-speed, high-density connector, Z-Ray^® provides the ultimate in design flexibility, from custom heights to full custom geometries. As an interposer, Z-Ray^® is a cost-saving removable interface between the IC package and main board. Z-Ray^® is ideal for the demands of military/defense, aerospace and R&D applications including radar, radio, navigation and sensors.

BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, as dual compression or single compression with solder balls. The contacts are assembled into rugged low-profile FR4 substrate under high pressure and temperature.

• Low-profile 1 mm body height (ZA8, ZA1 Series)
• 0.33 mm height for shortest signal path (ZA8H Series)
• One piece design

• Customer-specific pin counts for ultimate high density and speed flexibility
• Choice of 0.80 mm or 1.00 mm pitch grid
• Up to 400 I/Os standard with custom capabilities to 3,000+ I/Os
• Also Available: 1.00 mm pitch system with up to 400 I/Os,1.27 mm and 2 mm standard heights, and up to 56 Gbps performance (GMI Series)

• Configurations for any application, complete with detailed footprints
• Dual compression or single compression with solder balls
• Customer-specific stack heights, pin counts, insulator shapes, and plating thicknesses
• Customizable in the X, Y, and Z axes
• Wide variety of custom geometries
• Quick-turn customization with minimal NRE and tooling charges
• A variety of compression and alignment configurations available

• Performance up to 14 Gbps (ZA8, ZA1 Series) and 56 Gbps NRZ (ZA8H Series) with a migration path to 100 Gbps
• Up to 1,000 cycles, with alternate contact design for up to 3,000 cycles also available (tested to 85˚C)
• Low 30 g normal force with .008" contact deflection
• 500 mA per line
• Differential Vias™ PCB routing available
• Also Available: 1.00 mm pitch system with up to 400 I/Os, 1.27 mm and 2 mm standard heights, and up to 56 Gbps performance
  (GMI Series)
• Also Available: Ultra-low profile Z-Ray® Cable Assembly designed for high-speed, micro pitch applications (ZRDP Series)

• Engineered to provide precise alignment, compression and retention of dual compression (LGA) or single compression with solder balls (BGA) Z-Ray^®Interposers
• Z-Ray^® hardware systems are ultra-low profile and designed to reduce risk of damage to the interposer
• ZSO Series provides alignment for single compression solder ball interposers
• ZHSI Series provides alignment and ensures proper contact retention for dual compression interposers
• ZD Series press-in hardware provides proper PCB to interposer alignment for dual compression interposers

• 10 stack height options from 5 mm to 12 mm
• Audible click when mated
• Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
• Up to 100 contacts